Product Overview

Low Profile Metal Shell Soldercup Connector

Aptiv Interconnect Micro offers Low Profile Metal Shell Soldercup Connectors, providing a high-quality, environmentally sealed solution for demanding applications. Designed to operate from −55°C to +125°C, with high-temperature versions available up to +200°C (HT), these MIL-DTL-83513 compliant rectangular connectors support 9–51 contacts accepting 24 AWG wire. They ensure reliable mechanical performance with an engaging force of 6 oz max, separation force of 0.5 oz min, and mating/unmating force of 10 oz × number of contacts.

Low Profile Metal Shell Soldercup Connector product image

Features and Benefits

  • Low Profile Design: Compact metal shell ideal for space-constrained applications.
  • Environmentally Sealed: Ensures reliable performance in harsh conditions.
  • Wide Operating Temperature Range: −55°C to +125°C; HT versions up to +200°C.
  • Flexible Contact Options: Available in 9–51 contact configurations for 24 AWG wire.
  • MIL-DTL-83513 Compliant: Meets stringent military and industry standards.
  • Consistent Mating Performance: 6 oz max engaging, 0.5 oz min separation, 10 oz × contacts mating force.
  • Durable Metal Shell Construction: Provides superior shielding and mechanical strength.
  • Reliable Electrical Connectivity: Built for consistent signal integrity in critical systems.

Specifications, Parts, and Filters

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Contact Resistance
8 milliohm max contact only and 32 millohms max with 6" wire @ 2.5A at room temperature
Current Rating
3A max. at room temperature
Dielectric WithStanding Voltage
600 VAC at sea level, 150 VAC at 70,000 feet. 1mA leakage current max. at room temperature
Insulation Resistance
500 VDC and 5000 Megohms min. at room temperature

Engaging Force
6 oz max. at room temperature
Separation Force
.5 oz min. at room temperature
Mating/Unmating Force
10 oz x # of contacts max.at room temperature
Vibration
EIA-364-28 Condition IV, 1 microsecond max discontinuity at room temperature
Shock
EIA-364-27 Condition E, 1 microsecond max discontinuity at room temperature
Durability
500 matings, passes Mating Force, CR, Eng and Sep Forces at room temperature
Salt Spray
EIA 364-26 Condition B-48 hours at room temperature

Signal Pin Contacts
C17200 Beryllium Copper per ASTM B194
Signal Socket Contacts
C31400 Bronze Alloy per ASTM B140
Contact Plating
.000050 Thk Gold Plating per ASTM B488
Shell
6061-T6 Aluminum per SAE-AMS-QQ-A200/8 or Passivated 300 Series Stainless Steel
Shell Plating
Electroless Nickel per AMS 2404 or Cadmium Plated per SAE-AMS-QQ-P-416
Insulator Material
Polyphenylene Sulfide (PPS) Per MIL-M-24519 GST-40F
Hardware
Passivated Stainless Steel Per MIL-DTL-83513/05
Interfacial Seals
Fluorosilicone per MIL-R-25988 Std Profile Receptacles only)

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