Product Overview

Standard Profile Metal Shell Soldercup Connector Cryo Temp

Aptiv Interconnect Micro offers Micro-D Cryogenic Temperature Solder Cup Connectors designed for soldering to superconducting wires such as NbTi CuNi clad, manganin, and others. Based on the M83513 specification, these connectors use a special epoxy rated for cryogenic service down to 4 Kelvin. Operating within a temperature range of 4 K (−269.15°C) to +121°C, they provide exceptional reliability for quantum computing and other cryogenic applications. Available with 9 to 100 contacts.

Standard Profile Metal Shell Soldercup Connector Cryo Temp product image

Features and Benefits

  • Cryogenic Rated Design: Operates from 4 K (−269.15°C) to +121°C for extreme environments.
  • Special Epoxy Formula: Ensures reliability and performance at cryogenic temperatures.
  • M83513-Based Construction: Built on the proven Micro-D specification for consistency.
  • Supports Superconducting Wires: Ideal for NbTi CuNi clad, manganin, and similar materials.
  • Broad Application Use: Suitable for quantum computing and cryogenic systems.
  • Multiple Contact Options: Available with 9 to 100 solder cup contacts for design flexibility.
  • Reliable Performance: Maintains mechanical and electrical integrity at ultra-low temperatures.

Specifications, Parts, and Filters

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Contact Resistance
8 milliohm max contact only and 32 millohms max with 6" wire @ 2.5A at room temperature
Current Rating
3A max. at room temperature
Dielectric WithStanding Voltage
600 VAC at sea level, 150 VAC at 70,000 feet. 1mA leakage current max. at room temperature
Insulation Resistance
500 VDC and 5000 Megohms min. at room temperature

Engaging Force
6 oz max. at room temperature
Separation Force
.5 oz min. at room temperature
Mating/Unmating Force
10 oz x # of contacts max.at room temperature
Vibration
EIA-364-28 Condition IV, 1 microsecond max discontinuity at room temperature
Shock
EIA-364-27 Condition E, 1 microsecond max discontinuity at room temperature
Durability
500 matings, passes Mating Force, CR, Eng and Sep Forces at room temperature
Salt Spray
EIA 364-26 Condition B-48 hours at room temperature

Signal Pin Contacts
C17200 Beryllium Copper per ASTM B194
Signal Socket Contacts
C31400 Bronze Alloy per ASTM B140
Contact Plating
.000050 Thk Gold Plating per ASTM B488
Shell
6061-T6 Aluminum per SAE-AMS-QQ-A200/8 or Passivated 300 Series Stainless Steel
Shell Plating
Electroless Nickel per AMS 2404 or Cadmium Plated per SAE-AMS-QQ-P-416
Insulator Material
Polyphenylene Sulfide (PPS) Per MIL-M-24519 GST-40F
Hardware
Passivated Stainless Steel Per MIL-DTL-83513/05
Interfacial Seals
Fluorosilicone per MIL-R-25988 Std Profile Receptacles only)

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