Product Overview

Standard Micro-D

Aptiv Interconnect Micro (legacy website: www.ultimateconnector.com) designs and manufactures a broad range of precision engineered Micro D Connectors. In addition to the standard products shown below, Aptiv will collaborate on custom solutions to meet your interconnect needs. The contact center-to-center pitch for Micro-D Connectors is .050".

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Standard Micro-D product image

Features and Benefits

  • High-Density, Miniature Design : 0.050" contact pitch saves space and weight versus standard D-sub connectors.
  • MIL-DTL-83513 Compliant : Built to military standards for proven reliability under shock, vibration, and temperature extremes.
  • Flexible Termination Options : Offered in solder cup, wire, PCB (straight, right-angle, SMT), and flex terminations.
  • Rugged Metal Shell Construction : Provides EMI/RFI shielding, secure mating alignment, and up to 500 mating cycles.
  • High-Performance Twist Pin Contacts : Multi-wire design delivers low contact resistance and superior signal integrity.
  • Wide Operating Temperature Range : Performs from -55°C to +125°C, with high-temperature options for extreme environments.
  • Broad Application Versatility : Ideal for aerospace, defense, medical, industrial, and robotic systems.
  • Customizable Configurations : Available in aluminum, stainless steel, or plastic shells with various platings and contact counts (9–130)

Specifications, Parts, and Filters

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Contact Resistance
8 milliohm max contact only and 32 milliohms max with 6" wire @ 2.5A at room temperature (Micro-D wired and solder cup); 8 milliohm max contact only + any solid lead resistance (depends on wire AWG) @ 2.5A (Micro-D PCB right angle .050 x .100)
Current Rating
3A max. at room temperature
Dielectric Withstanding Voltage
600 VAC at sea level, 150 VAC at 70,000 feet, 1mA leakage current max. at room temperature
Insulation Resistance
500 VDC and 5000 Megohms min. at room temperature

Engaging Force
6 oz max. at room temperature; 6 oz max (PCB Signal contacts only; no data for Power or Coax contacts)
Separation Force
0.5 oz min. at room temperature; 0.5 oz min (PCB Signal contacts only; no data for Power or Coax contacts)
Mating/Unmating Force
10 oz × # of contacts max. at room temperature; 10 oz × # of contacts max (PCB Signal contacts only; no data for Power or Coax contacts)
Vibration
EIA-364-28 Condition IV, 1 µs max discontinuity
Shock
EIA-364-27 Condition E, 1 µs max discontinuity
Durability
500 matings, passes Mating Force, CR, Engaging and Separation Forces
Salt Spray
EIA-364-26 Condition B, 48 hours at room temperature (Wired, Solder Cup Metal Shell & PCB connectors)

Signal Pin Contacts
C17200 Beryllium Copper per ASTM B194
Signal Socket Contacts
C21000 Brass Alloy per ASTM B36 (Wired, PCB); C31400 Bronze Alloy per ASTM B140 (Soldercup)
Contact Plating
.000050 Thk Gold Plating per ASTM B488
Shell
6061-T6 Aluminum per SAE-AMS-QQ-A200/8 or Passivated 300 Series Stainless Steel
Shell Plating
Electroless Nickel per AMS 2404 or Cadmium Plated per SAE-AMS-QQ-P-416 (Metal Shell)
Insulator Material
Polyphenylene Sulfide (PPS) per MIL-M-24519 GST-40F
Hardware
Passivated Stainless Steel per MIL-DTL-83513/05
Interfacial Seals
Fluorosilicone per MIL-R-25988 (Std Profile Receptacles only)
PC Tails
Copper Wire per A-A-59551 Type S (PCB)
PC Tail Plating
.000320 min thk Tin plating per ASTM B545, or .000300 min thk Tin/Lead with minimum 3% lead plating per SAE-AMS-P-81728, or .000010 thk Gold plating per ASTM B488 (PCB)

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