Product Overview

SMP Series RF Connector

The SMP series from Aptiv Interconnect is a sub-miniature coaxial RF connector featuring a convenient push-on/snap-on coupling mechanism and blind-mate capability. Ideal for high-frequency applications up to 40 GHz, SMP connectors excel in high-density modular systems, board-to-board interconnects, and rack-and-panel designs where quick assembly, space-saving, and dependable performance are essential. Their unique design tolerates significant radial and axial misalignment, ensuring consistent contact even when precise alignment is challenging. Widely utilized in phased array antennas, satellite communication systems, high-speed digital test, military radar, and various telecommunications infrastructures, the SMP series offers robust performance for critical applications.

SMP Series RF Connector product image

Features and Benefits

  • Blind-Mate/Push-on Design: Rapid and easy connections in dense or hard-to-reach areas.
  • High Frequency Performance: Operates reliably up to 40 GHz for demanding applications.
  • Accommodates Misalignment: Ensures reliable connections with tolerance stack-ups.
  • Three Detent Levels: "Smooth Bore," "Limited Detent," and "Full Detent" for various retention needs.
  • Compact & Lightweight: Ideal for high-density and weight-sensitive applications.
  • 50 Ohm Impedance: Standardized for compatibility with most RF systems.
  • Robust Construction: Machined stainless steel with gold plating for durability and electrical integrity.

Specifications, Parts, and Filters

View All

Impedance
50 Ohms
Frequency Range
DC to 40 GHz (typical)
Voltage Rating
Typically 250 VRMS (max.)
Dielectric Withstanding Voltage
Typically 500 VRMS (min.)
Contact Resistance
Center Contact
≤ 6.0 mΩ
Outer Contact
≤ 2.0 mΩ
VSWR (Voltage Standing Wave Ratio)
Typical
≤ 1.30 @ 26.5 GHz; ≤ 1.50 @ 40 GHz (performance varies with detent level and specific design)
Insertion Loss
≤ 0.1 dB @ 20 GHz (typical)

Coupling Mechanism
Push-on / Snap-on (Blind-mate)
Detent Levels
Smooth Bore
Lowest retention, easiest mating/unmating, ideal for high-cycle test applications.
Limited Detent
Moderate retention, good for general purpose modular systems.
Full Detent
Highest retention, suitable for high vibration environments.
Mating Cycles
≥ 1000 cycles (Smooth Bore); ≥ 250 cycles (Limited Detent); ≥100 cycles (Full Detent)
Axial Misalignment
± 0.010 inches MAX (± 0.25 mm)
Radial Misalignment
± 0.010 inches MAX (± 0.25 mm)
Mating Force
Varies significantly by detent level
Unmating Force
Varies significantly by detent level
Body Material
Stainless Steel
Center Contact Material
Heat-treated Beryllium Copper with Gold Plating
Insulator Material
PTFE

Temperature Range
MIL-STD-202, Method 102, Test Condition C (-65°C to +165°C)
Thermal Shock
MIL-STD-202, Method 107, Test Condition B.
Vibration
MIL-STD-202, Method 204, Test Condition D
Shock
MIL-STD-202, Method 213, Test Condition I
Moisture Resistance
MIL-STD-202, Method 106, Less step 7b
Corrosion (Salt Fog)
MIL-STD-202, Method 101, Test Condition B

Similar Products

More From This Category

Find the Right Product

Find the Right Product for the Design

Access robust technical resources and expert engineering support to create interconnect solutions designed for demanding environments. From standard components to fully customized designs, we support every stage of the development process.